Via and Ericsson to partner on bluetooth chip manufacturing
E020928X5・E021002X5 Oct. 2002（E38）
Via Technologies Inc. announced on October 1 the signing of an agreement with Ericsson Technology Licensing AB, a subsidiary of the Swiss-based Ericsson, for the license of bluetooth IP. Via is the first Taiwanese semiconductor maker acquiring the license of Ericsson's bluetooth chip technology. With this licensed technology, Via is expected to expand its scale of wireless telecommunications.
According to the signed agreement, Via are licensed a number of Ericsson's commercialized and advanced bluetooth technologies, including bluetooth radio cores, bluetooth basehand cores, embedded bluetooth host & embedded software. Via, which has been the leader in PC and mobile appliances markets, is the desired partner for Ericsson to explore the computer arena, said Maria Khorsand, CEO of Ericsson Technology Licensing AB.
Source: Economic Daily News 09/28/2002
Commercial Times 10/02/2002
