TSMC and ASE lead the formation of 3DIC Advanced Packaging Manufacturing Alliance

　On September 9, 2025, Semiconductor Equipment and Materials International (SEMI) announced the official formation of the 3DIC Advanced Manufacturing Alliance (3DICAMA; hereinafter referred to as the “Alliance”), which is co-chaired by TSMC and ASE Group and brings together 37 leading companies, including Chroma and Hongsu, aiming to promote cross-domain collaboration and standardization and also to establish the most comprehensive 3DIC ecosystem.

　According to SEMI, 3DIC technology is facing multiple challenges.  Taiwan, with its comprehensive semiconductor supply chain and advanced mass production capacity and also its influence on international collaboration and standards formulation, has become an essential global hub for 3DIC and advanced packaging development.  

　TSMC and ASE jointly lead industry chain partners to promote 4 core tasks of 3DICAMA as summarized below.  

1.  For industry collaboration, the Alliance will connect the semiconductor industry chains to facilitate the cross-domain innovation and experience sharing; 

2.  The Alliance will focus on the strengthening of supply chain resilience and industrial support and build a more resilient and stable industrial system by enhancing local manufacturing and connecting global resources; 

3.  In terms of industrial standards, the Alliance will integrate the SEMI platform resources and industry consensus to establish technical standards and specifications that cover materials, processes, and design, promote standard implementation, and assist manufacturers and suppliers in effectively introducing and implementing systematic application standards; and 

4.  The Alliance will also focus on technology and quality upgrading and promote R&D cooperation in advanced packaging, so as to enhance manufacturing efficiency and yield and also actively address technical bottlenecks, such as, thermal management and advanced interconnect architectures.  In the field of measurement and testing, the Alliance will strengthen advanced testing technology and quality control, accelerate the implementation and broader application of new technologies, promote technology commercialization while simultaneously advancing system software and automation upgrades, as well as communication interface integration, and continuously enhancing the advanced packaging ecosystem.  (Released 2025.09.10)   
/CCS