Japan Will Invest in TSMC’s 3DIC R&D Center

　Ministry of Economy, Trade and Industry (MoETI), JAPAN announced on May 31, 2021:  The Japanese government will invest in TSMC’s project for establishing a 3DIC materials R&D center in Japan.  Said official investment made under Japan’s project for post-5G telecommunication infrastructure is authorized with a view to the R&D of advance technology in the field of semi-conductor fabrication.

　TSMC will put in over JPY18 billion and the Japanese government will contribute JPY19 billion through the New Energy and Industrial Technology Development Organization (NEDO).  Twenty (20) Japanese corporations including Ibiden, Shin-Estu Silicone each will also take a part in the project.

　According to the information made public by the MoETI, this 3DIC center will focus on the R&D of advance 3D packaging technology including new-generation processing and substrate materials, bonding process, measuring equipment.  A pilot fabrication line will be assembled in the cleanroom of National Institute of Advanced Industrial Science and Technology (AIST) located in Tsukuba-shi (筑波市) after the summer of 2021 with R&D work expected to officially start in 2022.  (Released 2021.06.01)