TSMC to build new plant in Japan to produce 22-nanometer and 28-nanometer wafers in 2024
E211014Y5 | Nov. 2021（E264）
A deal for TSMC (Taiwan Semiconductor Manufacturing Company Limited) to build a plant for wafer production in Japan has been finalized. Construction of the plant in Japan is scheduled to begin in 2022 with an initial plan for 22/28-nanometer processes technology and with mass production targeted to begin in 2024.
TSMC and Sony Semiconductor Solutions Corporation (“SSS”) jointly announced on November 9, 2021 that TSMC will establish a subsidiary, Japan Advanced Semiconductor Manufacturing Inc. (“JASM”) in the Japanese prefecture, Kumamoto, to provide foundry service with the initial technology of 22/28-nanometer processes to meet the strong demand for special technologies around the world. This deal has been fully supported by the Japanese government and SSS will hold minor stake in the subsidiary. (Released 2021.10.14)